flow: platforms: ihp-sg13g2: Generic pad.tcl

Provide a generic pad.tcl script to create a padfram for the
IHP SG13G2 platform. The design speicifc config.mk has to
define all pins for the north, south, east and west bank.

This padframe will the 70x70 bondpad by default, but can use
another bondpad via IO_BONDPAD_NAME and IO_BONDPAD_SIZE.

Signed-off-by: Daniel Schultz <dnltz@aesc-silicon.de>

Author: dnltz

flow/platforms/ihp-sg13g2/config.mk

@@ -101,6 +101,28 @@ export TAPCELL_TCL ?= $(PLATFORM_DIR)/tapcell.tcl
 
 export MACRO_PLACE_HALO ?= 40 40
 
+# Will be placed left to right
+export IO_NORTH_PINS ??=
+export IO_SOUTH_PINS ??=
+# Will be placed bottom to top
+export IO_EAST_PINS ??=
+export IO_WEST_PINS ??=
+
+# Variables for bondpad
+export IO_BONDPAD_SIZE ?= 70
+export IO_BONDPAD_NAME ?= bondpad_70x70
+# Variables for padframe
+export IO_LENGTH ?= 180
+export IO_WIDTH ?= 80
+export IO_SEALRING_OFFSET ?= 70
+export IO_FILLER_CELLS ?= \
+sg13g2_Filler10000 \
+sg13g2_Filler4000 \
+sg13g2_Filler2000 \
+sg13g2_Filler1000 \
+sg13g2_Filler400 \
+sg13g2_Filler200
+
 #---------------------------------------------------------
 # Place
 # --------------------------------------------------------

flow/platforms/ihp-sg13g2/pad.tcl

@@ -0,0 +1,41 @@
+set IO_OFFSET [expr { $::env(IO_BONDPAD_SIZE) + $::env(IO_SEALRING_OFFSET) }]
+
+# padframe core power pins
+add_global_connection -net {VDD} -pin_pattern {^vdd$} -power
+add_global_connection -net {VSS} -pin_pattern {^vss$} -ground
+
+# padframe io power pins
+add_global_connection -net {IOVDD} -pin_pattern {^iovdd$} -power
+add_global_connection -net {IOVSS} -pin_pattern {^iovss$} -ground
+
+make_fake_io_site -name IOLibSite -width 1 -height $::env(IO_LENGTH)
+make_fake_io_site -name IOLibCSite -width $::env(IO_LENGTH) -height $::env(IO_LENGTH)
+
+make_io_sites \
+  -horizontal_site IOLibSite \
+  -vertical_site IOLibSite \
+  -corner_site IOLibCSite \
+  -offset $IO_OFFSET
+
+# Place IO cells
+place_pads -row IO_NORTH $::env(IO_NORTH_PINS)
+place_pads -row IO_EAST $::env(IO_EAST_PINS)
+place_pads -row IO_SOUTH $::env(IO_SOUTH_PINS)
+place_pads -row IO_WEST $::env(IO_WEST_PINS)
+
+# Place Corner Cells and Filler
+place_corners sg13g2_Corner
+
+set iofill [regexp -all -inline {\S+} $::env(IO_FILLER_CELLS)]
+
+place_io_fill -row IO_NORTH {*}$iofill
+place_io_fill -row IO_EAST {*}$iofill
+place_io_fill -row IO_SOUTH {*}$iofill
+place_io_fill -row IO_WEST {*}$iofill
+
+connect_by_abutment
+
+set IO_BONDPAD_Y [expr { double($::env(IO_BONDPAD_SIZE)) * -1.0 }]
+place_bondpad -bond $::env(IO_BONDPAD_NAME) sg13g2_IOPad* -offset "5.0 $IO_BONDPAD_Y"
+
+remove_io_rows